Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional object

ABSTRACT

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part application of U.S. patentapplication Ser. No. 16/595,265, entitled “Three-Dimensional, AdditiveManufacturing System, and a Method of Manufacturing a Three-DimensionalObject,” filed Oct. 7, 2019, which claims the benefit of U.S.Provisional Application Ser. No. 62/742,505, entitled “MULTI-METHODthree-dimensional PRINTER,” filed Oct. 8, 2018, the entireties of whichare hereby incorporated by reference.

FIELD

The present disclosure relates to systems and apparatuses forthree-dimensional printing.

BACKGROUND

Three-dimensional, additive manufacturing (3D printing) has generated ahigh degree of interest in the potential for a faster and moreeconomical manufacturing approach since it was first conceived over 30years ago. To date, however, that potential has largely goneunfulfilled. Today, the vast majority of 3D printers are used to makedemonstration parts or nonfunctional prototypes, mostly from a plasticmaterial that is chosen primarily for compatibility with the printerrather than the materials requirement of the final part.

Among the issues preventing wider acceptance of 3D printing as acommercially viable manufacturing method is the requirement of specificapplications for specific materials compatible with these applications.Another issue is the need for enhanced precision in some sections of apart compared to the remaining bulk of the part. With currenttechnology, the need for enhanced precision forces the choice of a 3Dprinting technology capable of providing the required precision, whichtypically results in slower build rates than less precise methods. Theseslower build rates can have a significant cost impact on the final partif applied to the total volume of the part.

While 3D printing holds the potential to produce three-dimensionalobjects with more efficient use of materials and lower resultant weightof the finished object, most conventional 3D printing techniques depositor fix in place, a single voxel at a time. The most common 3D printers,of the fused deposition modeling (FDM) type, extrude a line of meltedpolymer. In addition to being severely limited by the availablematerials set, FDM is also very slow. Directed energy printers produce aphase change in a layer of material. The phase change may be broughtabout by sintering or melting by computer guided application of a laseror electron beam, or polymerization by directed exposure to selectedelectromagnetic radiation. Directed energy printers, as a class,significantly expand the available materials set and owing to the factthat they operate on a rapidly positioned layer of material, have thepotential to be faster than FDM printers. Of the current 3D printertechnologies, the printers with the greatest flexibility in materialsselection and the fastest speed are those employing jetted bindertechnology. These printers rapidly deposit a full layer of powder andthen fix a pattern in the powder by depositing a binding agent via anink jet-type printing head. The result is a system that builds objectsfrom a wide verity of materials at rates that are at least an order ofmagnitude greater than FDM printers.

Overall, jetted binder printers are the best among current technologybut can incorporate only a single material in an object. While they arecapable of patterning large amounts of materials per unit time, theminimum practical layer thickness achievable with such systems istypically around 25 μm. This limitation also limits the precision of theprinted layer.

Printing techniques such as electrophotography are capable of printinglarge areas with very high precision very rapidly but are limited toprinting very thin layers. The relatively low mass deposition rate ofelectrophotography and added complexity of electrophotographic systemsrender them unattractive for a 3D printing system if all voxels in anobject are formed electrophotographically.

SUMMARY

Embodiments of the invention are directed to a three-dimensional,additive manufacturing system described herein as a multi-material,multi-method printer system. The printer system comprises a system ofprinter modules. All the modules are directed by a central computersystem (sometimes referred to as a controller) to coordinate the modulesas necessary to deposit the proper material at the required precision toa single build location, while maximizing the overall build rate.Because high build rate is essential for economic operation, thepreferred basic technology for each module is jetted binder. Wherejetted binder technology does not provide the required properties forspecific voxels, printer modules may be based on more suitabletechniques. For example, directed energy beam printers orelectrophotographic printers may be used.

In one embodiment, printer modules incorporating jetted bindertechnology are combined with printer modules based on othertechnologies. The multi-materials 3D printer described in U.S.provisional patent application 62/682,067, entitled “Multi-Materials 3DPrinter” filed June 7, 2018, and U.S. patent application Ser. No.16/167,088, entitled “Multi-Material Three Dimensional Printer” filedOct. 22, 2018, the entireties of which are hereby incorporated byreference, represents one of the jetted binder technologies that may beincorporated into a printer module of the multi-material multi-method 3Dprinter of the present invention.

The solution to the problems described above is the ability to employprinting techniques that are optimized for the materials needed for theapplication and for the precision needed for specific voxels within thepart. Embodiments of the invention provide a solution by providing a 3Dprinting system comprising a plurality of materials printer modules,each of these modules chosen for its ability to deposit a specificmaterial or group of materials at the precision required for specificvoxels of the target application.

In accordance with one aspect of the invention, a jetted binder printingsystem is disclosed that includes a carrier substrate on which multiplepatterned single-layer objects are formed, the patterned single-layerobjects being separated from each other on the carrier substrate, thecarrier substrate being displaced along a direction of travel; adispensing module to dispense fluidized particles onto the carriersubstrate to form a material layer; a compaction module positioneddownstream from the dispensing module along the direction of travel, toincrease the compaction of the material layer to a predeterminedcompaction range; a binder printer positioned downstream from thecompaction module along the direction of travel, to print a bindermaterial on the material layer according to a predetermined pattern; afusion module positioned downstream from the binder printer along thedirection of travel, to cause selective fusion of the material layeraccording to the predetermined pattern; a material removal modulepositioned downstream from the fusion module along the direction oftravel, to remove non-fused portions of the material layer to form oneof the patterned single-layer objects; a transfer module positioneddownstream from the material removal module along the direction oftravel, to transfer the one of the patterned single-layer objects fromthe carrier substrate to an assembly plate; an assembly stationcomprising the assembly plate, the patterned single-layer objects beingassembled into a stack on the assembly plate according to apredetermined sequence of objects including the patterned single-layerobjects; and a controller to control the predetermined sequence andpredetermined patterns.

In the jetted binder printing system of the preceding paragraph, thecarrier substrate may be a belt.

In the jetted binder printing system of the preceding paragraphs, thecarrier substrate may additionally comprise an adhesion control layer onwhich the material layer is formed.

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a powder container configured to containa fluidized powder in a predetermined controlled condition prior todispensing particles onto the carrier substrate.

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a plurality of powder container, one foreach fluidized powder to be used in creating predetermined jetted binderlayers in a 3D printed part, each configured to contain a fluidizedpowder in a predetermined controlled condition prior to dispensingparticles onto the carrier substrate.

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a dispensing controller configured toprecisely meter an amount of fluidized particles dispensed onto thecarrier substrate

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a plurality of dispensing controllers,one for each of the plurality of powder containers, each configured toprecisely meter an amount of fluidized particles dispensed onto thecarrier substrate from each of the plurality of powder containers.

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a roller to spread the fluidizedparticles on the carrier substrate.

In the jetted binder printing system of the preceding paragraphs, thedispensing module may comprise a plurality of rollers to spread thefluidized particles on the carrier substrate.

In the jetted binder printing system of the preceding paragraphs, thecompactor module may comprise a calendar.

In the jetted binder printing system of the preceding paragraphs, thecompactor module may comprise a compliant pressure cuff or a pressureplate assembly.

In the jetted binder printing system of the preceding paragraphs, thecompactor module may comprise a vibratory energy source to causesettling of the fluidized particles.

In the jetted binder printing system of the preceding paragraphs, thebinder printer may comprise an ink jet print head.

In the jetted binder printing system of the preceding paragraphs, thefusion module may comprise an energy source selected from the following:ultraviolet (UV) source, infrared (IR) source, electron beam source, anda heat source.

In the jetted binder printing system of the preceding paragraphs, thefusion module may comprise a reactive agent dispenser to dispense areactive agent that reacts with the binder material and the fluidizedparticles to immobilize the fluidized particles.

In the jetted binder printing system of the preceding paragraphs, thematerial removal module may comprise a mechanical disrupter.

In the jetted binder printing system of the preceding paragraphs, thematerial removal module may comprise an air knife.

In the jetted binder printing system of the preceding paragraphs, thematerial removal module may comprise a vacuum port.

In the jetted binder printing system of the preceding paragraphs, theassembly station may additionally comprise a lateral positioner tolaterally displace the assembly plate.

In the jetted binder printing system of the preceding paragraphs, theassembly station may additionally comprise a vertical positioner tovertically displace the assembly plate.

In the jetted binder printing system of the preceding paragraphs, thecarrier substrate may comprise a fiducial marker for each of thepatterned single-layer objects; and the assembly station may comprise analignment sensor to align the fiducial markers to the assembly plate.

In the jetted binder printing system of the preceding paragraphs, thecontroller may additionally control the predetermined compaction rangeof each material layer.

In the jetted binder printing system of the preceding paragraphs, thetransfer module may comprise a pressure roller or a pressure plate.

In accordance with another aspect of the invention, a method ofmanufacturing a three-dimensional object is disclosed that includesrepeatedly forming patterned single-layer objects according to apredetermined sequence and predetermined patterns; and assembling thesequence of the patterned single-layer objects into thethree-dimensional object on an assembly plate; wherein the step offorming each of the patterned single-layer objects comprises: dispensingfluidized particles onto a carrier substrate to form a material layer;compacting the material layer to a predetermined compaction range;printing a binder material on the material layer according to apredetermined pattern; selectively fusing the material layer accordingto the predetermined pattern; removing non-fused portions of thematerial layer to form one of the patterned single-layer objects; andtransferring the one of the patterned single-layer objects from thecarrier substrate to the assembly plate.

BRIEF DESCRIPTION OF THE FIGURES

The disclosure may be more completely understood in consideration of thefollowing detailed description of various embodiments of the disclosurein connection with the accompanying drawings, in which:

FIG. 1 is a block diagram of some of the major components of athree-dimensional, additive manufacturing system in accordance with oneembodiment of the invention.

FIG. 2 is a schematic diagram of the relationships and communicationpaths among some of the components of a three-dimensional, additivemanufacturing system in accordance with one embodiment of the invention.

FIG. 3 is a schematic diagram of the relationships and communicationspaths among components of a jetted binder printer module in accordancewith one embodiment of the invention.

FIG. 4 is a schematic diagram of the relationships and communicationspaths among components of a generic printer module in accordance withone embodiment of the invention.

FIG. 5 is a schematic diagram illustrating some components of athree-dimensional, additive manufacturing system including a jettedbinder printer module in accordance with one embodiment of theinvention.

FIG. 5a is a schematic diagram illustrating some components of athree-dimensional, additive manufacturing system including a jettedbinder printer module in accordance with one embodiment of theinvention.

FIG. 6 is a schematic diagram illustrating a fluidized material removalmodule in accordance with one embodiment of the invention.

FIG. 7 is a schematic diagram illustrating a transfer module inaccordance with one embodiment of the invention.

FIG. 8 is a schematic diagram illustrating a transfer module inaccordance with one embodiment of the invention.

FIG. 9 is a schematic diagram illustrating a transfer module inaccordance with one embodiment of the invention.

FIG. 10 is a schematic diagram illustrating a transfer module inaccordance with one embodiment of the invention.

FIG. 11 is a schematic diagram illustrating one arrangement of athree-dimensional, additive manufacturing system in accordance with oneembodiment of the invention.

FIG. 12 is a schematic diagram illustrating another arrangement of athree-dimensional, additive manufacturing system in accordance with oneembodiment of the invention.

FIG. 13 is a flow diagram of a method of manufacturing athree-dimensional object in accordance with one embodiment of theinvention.

FIG. 14 is a flow diagram of a method of manufacturing patternedsingle-layer objects in a jetted binder printer module in accordancewith one embodiment of the invention.

FIG. 15 is a schematic diagram illustrating the assembly of single-layerobjects into a three-dimensional object in accordance with oneembodiment of the invention.

FIG. 16 is a schematic diagram illustrating some components of athree-dimensional, additive manufacturing system including a jettedbinder printer module in accordance with one embodiment of theinvention.

DETAILED DESCRIPTION

The invention is described with reference to the attached figures,wherein like reference numerals are used throughout the figures todesignate similar or equivalent elements. The figures are not drawn toscale and they are provided merely to illustrate the instant invention.Several aspects of the invention are described below with reference toexample applications for illustration. It should be understood thatnumerous specific details, relationships, and methods are set forth toprovide a full understanding of the invention. One having ordinary skillin the relevant art, however, will readily recognize that the inventioncan be practiced without one or more of the specific details or withother methods. In other instances, well-known structures or operationsare not shown in detail to avoid obscuring the invention. The inventionis not limited by the illustrated ordering of acts or events, as someacts may occur in different orders and/or concurrently with other actsor events. Furthermore, not all illustrated acts or events are requiredto implement a methodology in accordance with the invention.

A three-dimensional, additive manufacturing system is disclosed. Thefirst and second printer modules form sequences of first patternedsingle-layer objects and second patterned single-layer objects on thefirst and second carrier substrates, respectively. The patternedsingle-layer objects are assembled into a three-dimensional object onthe assembly plate of the assembly station. A controller controls thesequences and patterns of the patterned single-layer objects formed atthe printer modules, and a sequence of assembly of the first patternedsingle-layer objects and the second patterned single-layer objects intothe three-dimensional object on the assembly plate. The first transfermodule transfers the first patterned single-layer objects from the firstcarrier substrate to the assembly station in a first transfer zone andthe second transfer module transfers the second patterned single-layerobjects from the second carrier substrate to the assembly station in asecond transfer zone. The first and second printer modules areconfigured to deposit first and second materials under first and seconddeposition conditions, respectively. The first and second materials aredifferent and/or the first and second deposition conditions aredifferent.

Definitions

To improve ease of understanding throughout this disclosure, certaindefinitions are provided below:

Printer module—A patterning and deposition system configured to create aprinted object (also referred to as a single-layer object) on a carriersubstrate.

Transfer module—A transport system configured to receive a printedobject from a printer module and of transfer that printed object into aprinted layer of a printed part.

Assembly apparatus—A system configured to receive printed objects from aplurality of transfer modules and assemble the received printed objectsaccording to a predetermined sequence (instructed by a controller) insuch a way as to form printed parts according to a predetermined design.

Printed part—A stack of printed layers, fused together to form a part (athree-dimensional object) conforming to a predetermined design.

Printed Layer—A material layer, one voxel thick, that consists of one ormore printed objects. These printed objects, and hence the printedlayer, conform to the requirements of a specific printed part design.For example, a printed layer might consist of two printed objects, thefirst of which is made at a first printer module and the second of whichis made at a second printer module.

Printed object—A material layer, one voxel thick, formed at a printermodule. Also referred to as a single-layer object. When assembled andfused into a printed part (a three-dimensional object) according to apredetermined sequence, the resulting three-dimensional object conformsto the requirements of a specific printed part design. The pattern ofthe printed object (single-layer object) conforms to a pattern at apredetermined location in the printed part.

Previously transferred objects—The entire assembly of printed objectsthat have been assembled at the assembly apparatus before the printedobject (single-layer object) being currently transferred. It is possiblethat the printed object being currently transferred will be added to thetopmost layer, in which case the topmost layer would not yet have all ofthe printed objects required according to the printed part design.

A Plurality of Printer Modules

The multi-material, multi-method 3D printer system of the presentinvention comprises an arrangement of a plurality of printer modules.Each printer module comprises a mechanism for creating a precise androbust printed object (single-layer object). Each printed object maycomprise a predetermined material and conform to a predetermined set ofphysical requirements. Each one of the plurality of printer modules maybe coupled to and communicate with one of a plurality of transportmodules. Each one of the plurality of transport modules may comprise acarrier substrate upon which an associated printer module may form a 3Dprinted object. Each transport module may additionally comprise atransfer mechanism to transfer a printed object to an assemblyapparatus. The assembly apparatus may comprise a build station and mayadditionally comprise a positioning apparatus. The build station issometimes referred to as an assembly apparatus.

Printed Objects Stacked to Form a Printed Part

FIG. 1 illustrates a three-dimensional additive manufacturing system100, in accordance with embodiments of the present disclosure. Thecomponents illustrated in FIG. 1 function in coordination with the restof the components as directed by a computer system 10 (controller),illustrated in FIG. 2. The computer system 10 is directed by a designfile 310 program which may contain all the information necessary to forthe central processing unit 320 to cause the plurality of components ofthe 3D multi-material, multi-method printer system 100 to create thepredetermined multi-material printed part (three-dimensional object) tobe constructed.

As shown in FIG. 1, the three-dimensional additive manufacturing system100 can includes multiple deposition and patterning (print) modules A,multiple transfer modules B and multiple transfer mechanisms C. Each ofthe transfer mechanisms C is connected to an assembly station 110, whichis connected to a positioning module 230. The print modules A of themulti-material, multi-method printer system may be chosen for theircapability to create printed objects of required physicalcharacteristics in a predetermined material. In one embodiment, at leasthalf of the printer modules incorporated in the printer system may bebased on jetted binder technology.

A plurality of printed objects, each from the ones of a plurality ofprinter modules may be transferred to the assembly station 110 to form aprinted layer. A plurality of printed layers may be sequentially stackedone upon the other to form one or a plurality of multi-material printedparts (three-dimensional object).

The positioning module 230 may be used to position the assembly (orbuild) station 110 relative to any designated one of the plurality ofthe transfer mechanisms C. Combined, the build station 110 andpositioning apparatus 230 comprise an assembly apparatus.

Computer System

FIG. 2 illustrates an exemplary computer system for controlling themanufacturing system 100. Each print module or station A comprises anassociated print station controller 401, 402, 403. As shown in FIG. 2,the print station controllers 401, 402, 402 are directed by a centralprocessing unit 320 through an interface bus 350. Central processingunit 320 may also coordinate the actions of assembly apparatus C.Computer system 10 also comprises an input device 302 for loading designfile 310 and other operating instructions, memory 306 for storing thedesign file for direct access by central processing unit 320 and outputdevice 304.

FIG. 3 illustrates an individual jetted printer station controller. Asshown in FIG. 3, the central processing unit 320is connected to thecomponents of the jetted binder printer module. Print station controlunit 401 represents one of the plurality of print station control unitsand directs the actions of a carrier device 200, a dispensing device 20,a compaction device 30, a printing device 40, a fixing device 50, and afluidized material removal device 60 of the jetted binder printer modulethrough a device controller 420.

FIG. 4 represents a control configuration of a 3D printer module otherthan a jetted binder printer module. Regardless of the basic printingtechnology, the interface between the central processing unit 320 and aprint station control unit 401 may be identical. The interface between aprint station control unit and the component 1 451, component 2 452 andcomponent n 453 of the printer module may be customized to optimizeperformance based on the requirements of the print module performance.In some embodiments, a device controller 420 may be intermediate betweena print station control unit 401 and the individual components 451, 452,453. In another embodiment, the print station control unit 401 maycommunicate directly with the individual components 451, 452, 453.

In one embodiment, each of the printer modules may be controlled bydedicated controller and each printer control module may be coordinatedby a central processing unit to create printed objects in a sequenceappropriate for assembling printed layers and printed parts.

3D Printer System

FIG. 5 illustrates some of the basic components of a 3D printer system.For simplicity only one of a plurality of printer modules A and transfermodules B are represented in FIG. 5. FIG. 5 further illustrates apossible relationship between printer module A, transfer module B andassembly apparatus C.

Jetted Binder Printer Module

Printer module A of FIG. 5 is represented as a jetted binder printermodule 1 and comprises components to create a printed object from asingle powdered material, conforming to a predetermined physicalspecification. A jetted binder printer module 1 may create a printedobject on a carrier substrate 200 of transfer module B.

FIG. 16 illustrates another embodiment of some of the basic componentsof a jetted binder printer module 1 and comprises components to create aprinted object from a plurality of powdered materials conforming to apredetermined physical specification. A jetted binder printer module 1of this embodiment may create one or a plurality of printed objects on acarrier substrate 200 of transfer module B.

Transfer Module

In addition to carrier substrate 200, transfer module B may comprise oneor more buffer devices 212, 210 and a transfer device 76. Carriersubstrate 200 may comprise an endless loop (endless belt) ofmechanically stable material such as, but not limited to, a steel alloy,a copper alloy or a polymeric material. Carrier substrate 200 may alsocomprise a mechanically stable material coated with a material tocontrol adhesion of printed objects to the carrier substrate 200. Theadhesion control material coated on carrier substrate 200 may be chosento control the adhesion of printed material within a predetermined rangefor the 3D printed material of the current printed object. The adhesioncontrol material may comprise for example, a silicone material, afluoropolymer material, or a thin film metal such as gold.

In an alternative embodiment, as shown in FIG. 5a , carrier substrate200 may comprise a length of mechanically stable material played intotransfer module B from source reel 214. Source reel 214 may be providedat a distal end of transfer module A. After a printed object istransferred off carrier substrate 200 in transfer area 240, the usedlength of carrier 200 may be accumulated on take-up reel 216. Carriersubstrate 200 of FIG. 5a may comprise a mechanically stable materialcoated with a material to control adhesion of printed objects to thecarrier substrate 200. The adhesion control material coated on carriersubstrate 200 may be chosen to control the adhesion of printed materialwithin a predetermined range for the 3D printed material of the currentprinted object. The adhesion control material may comprise for example,a silicone material, a fluoropolymer material, or a thin film metal suchas gold. In any case, the carrier substrate is displaced along adirection of travel while the printer system is operating.

In accordance with an embodiment of the present invention, jetted binderprinter module 1 may be in communication with carrier substrate 200 oftransfer module B in order to create a 3D printed object on carriersubstrate 200.

At a distal end of transfer module B, a dispensing device 20 can beprovided. Dispensing device and dispensing module are usedinterchangeably herein. The dispensing device 20 can simply be adispenser configured to dispense fluidized material. The dispensingdevice 20 can include a materials storage device 24 and a dispensingcontroller device 22. The dispensing controller 22 can be configured toprecisely meter an amount of fluidized material onto a carrier substrate200. The dispensing controller 22 can also be configured to preciselycontrol the uniformity of the deposited fluidized material. Thedispensing module can include a roller to spread the fluidized particleson the carrier substrate.

In some embodiments, the dispensing device may comprise a plurality ofmaterial storage devices 21 and a plurality of dispensing devices 22.FIG. 16 illustrates an embodiment in which the dispensing module has aplurality of material storage devices 24 and a plurality of dispensingdevices 22.

Near the distal end of the transfer module B, a compaction device 30 canbe provided. Compaction device is sometimes referred to as a compactionmodule. The compaction module is positioned downstream from thedispensing module along the direction of travel. In some embodiments,the compaction device 30 can include a roller, made up of a hardenedmetal material designed as a cylindrical tube. In other embodiments, thecompaction device 30 can include a compliant pressure cuff, or anotherdevice configured to apply a controlled pressure orthogonal to the planeof the deposited fluidized material and the carrier substrate 200. Thecompaction device 30 can also include a settling device configured toprovide vibration. The vibration of the compaction device 30 can improvethe distribution and compaction of the fluidized material. In someembodiments, the compaction device 30 can be configured to compact afluidized material to a high density of at least 40% of the theoreticaldensity of the fluidized material.

Printing Device

Near the distal end of the carrier substrate 200, a printing device 40(also referred to as a binder printer) can be provided. The binderprinter is positioned downstream from the compaction module along thedirection of travel. The printing device 40 can be configured to deposita liquid binding material to fix a predetermined pattern into afluidized material. The precise pattern can be fixed into the fluidizedmaterial by binding the fluidized material into a connected and robustmass. In some embodiments, the printing device 40 can be an ink jet typeprint head under direct control of a computer system of FIG. 2 and FIG.3. The computer system can be instructed using a set of patterninginstructions, for instance a predetermined CAD (computer aided design)program.

The printing device 40 can include an ink jet type print head withjetting nozzles spanning the width of the carrier substrate 200. The inkjet type print heads can also be provisioned at a sufficient density toachieve a desired print resolution. The ink jet type head can be fixedin position and the functioning of each jetting nozzle can becoordinated with the movement of the carrier substrate 200 to create thedesired pattern in the fluidized material. Movement of carrier substrate200 relative to printing device 40 may be implemented by proximal buffer212 and printing device motor 250 as controlled computer system 10.Additional buffers may be positioned between proximal buffer 212 anddistal buffer 210, to more precisely control the interaction between thedeveloping 3D printed object and any of the components of jetted binderprinter module 1.

In alternative embodiments, the printing device 40 can include an inkjet head that includes fewer jetting nozzles than are required to spanthe width of carrier substrate 200, and yet achieve a printed object thefull width of carrier substrate 200 and a desired resolution. The inkjet type head can be movable, under computer control, across the widthof the carrier substrate 200, and the movement of both the ink jet typeprint head and proximal buffer 212 and printing drive motor 250 may becoordinated to achieve the desired fixed printed pattern in thefluidized material.

The printing device 40 may comprise one or more commercially availableprint heads. For example, Fujifilm supplies an array of print heads witha wide range of properties to accommodate the range of requirementsanticipated. In a preferred embodiment, printing device 40 may deliver ameasured and adjustable volume of binder to a target voxel of theprinted object 91 with every pulse of the print head. Printing device 40may deliver one or more measured volume to each voxel under control ofthe computer system. In a preferred embodiment, the print head 40 may becapable of 600 dpi resolution and each jet may deposit up to 200picolitre (pl) during each pulse.

Fixing Device

Near the center of the carrier substrate 200, a fixing device (or fusionmodule) 50 can be provided. The fusion module or fixing device 50 ispositioned downstream from the binder printer along the direction oftravel. The fixing device 50 can be configured to solidify the liquidbinding material, thus fixing the fluidized material exposed to theliquid binding material in a robust solid pattern. The fixing device 50can be a source of radiant energy that may interact with the liquidbinding material to cause it to become solid. In some embodiments, theradiant energy can be IR radiation, UV radiation, electron beam, orother known radiation types. Alternatively, the fusion module 50 caninclude a heat source. It should be understood the fixing device 50 doesnot need to be limited to the disclosed radiation types, as this list ispresented for exemplary embodiments and not intended to be exhaustive.Alternatively, the fixing device 50 can include a device for dispersinga reactive agent. The reactive agent can be configured to react with theliquid binding material and the fluidized material to convert thefluidized material to a robust mass.

Fluidized Material Removal Device

A fluidized materials removal device 60 can be provided downstream,relative to movement of carrier substrate 200, from the fixing device50. The fluidized material removal device 60 is sometimes referred to asa material removal module. The material removal module is positioneddownstream from the fusion module along the direction of travel. Thefluidized materials removal device 60 can be configured to remove all ofthe fluidized material deposited and compacted onto the carriersubstrate 200. The fluidized materials removal device 60 can remove thefluidized material deposited and compacted onto the carrier substrate,but not fixed in place by the liquid binder material.

The fluidized material removal device 60 is illustrated in detail inFIG. 6. As shown in FIG. 6, the fluidized material removal device 60includes an enclosure 63 which can have a distal end and a proximal end.Carrier substrate 200, with fixed fluidized material 88 of a printedobject 91 and compacted fluidized material 85 may be transported from adistal end to a proximal end of enclosure 63. Enclosure 63 may contain adisruptive device 61 (mechanical disrupter), such as a brush or a probe,to loosen compacted powder 84. Disruptive device 61 may be designed tohave disruptive strength sufficient to disrupt compacted powder that hasnot been fixed in place by binder from printing device 40, but to nothave disruptive strength sufficient to disrupt compacted powder whichhas been treated with binder from printing device 40 and fixed by fixingdevice 50 of FIG. 5. Once loosened from attachment to powder fixed inplace by binder from printing device 40 of FIG. 5, residual powder 86may be further dislocated and aerosolized by an air knife device 62.When the non-fixed compacted powder 84 is fully dislodged andaerosolized within enclosure 63, fixed powder 88 may remain attached tocarrier substrate 200. The aerosolized compacted powder 84 may beremoved from enclosure 63 by a vacuum force attached to vacuum port 64.

Transfer Module

As discussed above, each multi-method printer system may be providedwith a plurality of transfer modules B. In one embodiment, one transfermodule B may be provided in communication with each one of a pluralityof printer modules A associated with the printer system. Transfer moduleB is positioned downstream from the material removal module along thedirection of travel. A transfer module B may provide a substrate for thecreation of a printed object and to cause the transfer of a printedobject from that substrate (carrier substrate 200) to assembly apparatusC. As shown in FIG. 5, the transfer module B comprises a substrate 200,one or more buffers 210 and/or 212, one or more substrate drives 250,260, and a transfer area 240. In some embodiments, the proximal buffer212 may be provided between fluidized material removal device 60 andtransfer area 240 (also referred to as transfer zone) in order tocoordinate the residence time of a 3D printed object relative totransfer area 240 with the components of jetted binder print module 1.

Substrate 200 may comprise a length of flexible material that may bescaled such that its width is equal to or wider than build plate 80. Thematerial of carrier substrate 200 may be, but is not limited to a steelalloy or a polymeric material such as polyester orpolytetrafluoroethylene, or a composite material. The surface of carriersubstrate 200 may be chosen to control the adhesion between substrate200 and the materials to be printed by the associated printer module. Inone embodiment, substrate 200 may comprise a loop of material that maytraverse transfer module B from a distal buffer device 210 through aproximal buffer device 212 and back through a transfer device 76 to adistal buffer 212.

Transfer module B may comprise buffers in addition to distal buffer 210and proximal buffer 212 in order to provide differential movement ofcarrier substrate 200 relative to components of printer module A andtransfer device 76 to accommodate for different motion requirementsbetween deposition, patterning, and transferring a printed object tobuild plate 80 or to the top of a stack of previously transferredobjects 90.

Carrier substrate 200 may be moved by printing drive motor 250 and bytransfer drive motor 260. Substrate 200 may also be provided withadditional devices for controlling the movement of substrate 200 incompliance with the requirements of the individual steps of printedobject formation and transfer to build station 110. Transfer device 76can be implemented downstream, relative to the progressive movement ofcarrier substrate 200, from the fluidized materials removal device 60.Movement of a 3D printed object on carrier substrate 200 throughtransfer area 240 can be coordinated by distal buffer device 210 andtransfer motor drive 260, which may be controlled by the computer systemof FIG. 2 and FIG. 3.

Roller Transfer Device

As shown in FIG. 7, the transfer device 76 may be configured to transfera printed object 91 from carrier substrate 200 by causing contact and apressure between printed object 91 and build plate 80 or the top of astack of previously transferred printed objects 90. In an embodiment oftransfer device 76, as shown in FIG. 7, the transfer device 76 includesa roller 79 and a carrier to support and move roller 79 vertically. Insome embodiments, a carrier may be a two-axis carrier 77 to move roller79 vertically and horizontally relative to carrier substrate 200.Vertical movement of two axis carrier 77 may deflect carrier substrate200 and cause printed object 91 to make pressure contact with buildplate 80 or the top of a stack of previously transferred printed objects90. A horizontal movement of two-axis carrier 77 may then cause aprogressively moving line contact moving in a predetermined directionfrom a one end printed object 91 to another end of printed object 91.The moving line contact across printed object 91 can transfer printedobject 91 to build plate 80 or the top of a stack of previouslytransferred printed objects 90. Transfer device 76 may further comprisean adhesion modifier device 74.

Adhesion Modifier Device

An adhesion modifier device 74 may be provided that adjusts the adhesionstrength of printed object 91 to carrier substrate 200 to facilitate therelease of printed object 91 to build plate 80 or the top of a stack ofpreviously transferred printed objects 90. Adhesion modifier device 74may further modify the adhesion of printed object 91 to the surface ofbuild plate 80 or the top of a stack of previously transferred printedobjects such that the adhesive strength between a printed object 91 andcarrier substrate 200 is less than the adhesive strength between aprinted object 91 and build plate 80 or the top of a stack of previouslytransferred printed objects 90. Adhesion modifier device 74 may act uponthe interface between carrier substrate 200 and printed object 91 byapplying a stimulus to carrier substrate 200 or printed object 91 orboth. The application of the stimulus can facilitate a reduction inadhesion of printed object 91 to carrier substrate 200. The stimuluscausing an adjustment of adhesion from adhesion modifier 74 may be, butis not limited to a thermal stimulus, a radiation stimulus, a magneticstimulus, a mechanical stimulus or a particle beam stimulus. Printedobject 91 may also comprise an alignment fiducial 102.

Pressing Device

In another embodiment, as shown in FIG. 8, the transfer device 76 maycomprise a pressing device 82. Pressing device 82 can be provided withsingle-axis carrier 78 to provide vertical movement of pressing device82. The vertical movement of pressing device 82 may cause carriersubstrate 200 to be deflected vertically and for printed object 91 tocome into contact, with a pressure, to build plate 80 or the top of astack of previously transferred printed objects. The transfer device 76of FIG. 8 may also comprise an adhesion modifier device 74 similar tothe adhesion modifier device 74 of FIG. 7

Shape Modifier

In another embodiment of the invention, as shown in FIG. 9, the transferdevice 76 may be provided with a pressing device 82 and a shape modifierdevice 72. The transfer device 76 of FIG. 9 can also be provided with asingle-axis carrier 78 which may provide vertical movement of pressingdevice 82. The vertical movement of pressing device 82 may cause carriersubstrate 200 to be deflected vertically and for printed object 91 tocome into contact, with a pressure, to build plate 80 or the top of astack of previously transferred printed objects. Shape modifier 72 maycomprise a preformed shaped structure which may be comprised of anelastic material that may be flattened by mechanical pressure appliednormal to the shaped surface. As single axis carrier 78 brings printedobject into contact with build plate 80 or the top of a stack ofpreviously transferred printed objects 90, shape modifier 72 canprogressively flatten and thus progressively bring printed object 91into contact with build plate 80 or the top of a stack of previouslytransferred printed objects 90. The progressively moving contact betweenbuild plate 80 or the top of a stack of previously transferred printedobjects 90 may assure a uniform attachment between printed object 91 andbuild plate 80 or the top of a stack of previously transferred printedobjects 90. The transfer device 76 of FIG. 9 may also comprise anadhesion modifier device 74 similar to adhesion modifier device 74 ofFIG. 7

Articulating Transfer Device

In yet another embodiment of the invention, as shown in FIG. 10, thetransfer device 76 may be provided with a shaped pressing device 84 andan articulating device 83. Transfer device 76 of FIG. 10 can also beprovided with a two-axis carrier 77 which may provide horizontal andvertical movement of shaped pressing device 84. Under the control ofcomputer system 10, the vertical and horizontal movement of shapedpressing device 84 may cause carrier substrate 200 to be deflectedvertically and for printed object 91 to come into contact, with apressure, to build plate 80 or the top of a stack of previouslytransferred printed objects. Vertical movement of two-axis carrier maycause a predetermined end of shaped pressing device 84 to come intopressure contact with carrier substrate 200 such that a predeterminedend of printed object 91 is in contact with build plate 80 or the top ofa stack of previously transferred printed objects 90. Coordinatingfurther vertical and horizontal movement of two-axis carrier 77 witharticulating device 83 can cause the entire shaped surface of shapedpressing device 84 to progressively come into line contact, withpressure, to carrier substrate 200. The progressive line contact tocarrier 200 may cause deflection of carrier substrate 200 to causeprogressive line contact between printed object 91 and with build plate80 or the top of a stack of previously transferred printed objects 90.The progressive line contact between printed object 91 and build plate80 or the top of a stack of previously transferred printed objects 90being sufficient to transfer printed object 91 to build plate 80 or thetop of a stack of previously transferred printed objects 90. Thetransfer device 76 of FIG. 10 may also comprise an adhesion modifierdevice 74 similar to adhesion modifier device 74 of FIG. 7.

Assembly Apparatus

Assembly apparatus C, a portion of which is illustrated in FIG. 5, maycomprise a X-Y positioner device 230 and a build station 110. Buildstation 110 may comprise a build plate 80. A Z axis positioner device100 (vertical positioner) may be provided which may adjust the verticalposition of build plate 80 to maintain the level of the top ofpreviously transferred printed objects 90 at a predetermined verticalposition to facilitate proper transfer of a printed object to buildplate 80 or the top of a stack of previously transferred objects 90. Thecompleted assembly of the patterned single-layer objects on the buildplate is fused together under conditions suitable for the materialsinvolved.

Adhesion Reducing Device

Build plate 80 may comprise adhesion reducing device 68 to facilitateremoval of the completed stack of printed objects from the build plate80. Adhesion reducing device 68 may be activated to reduce the adhesionof the stack of previously transferred objects 90 by an appliedstimulus. The stimulus which may cause adhesion reducing layer 68 torelease the stack of previously transferred objects 90, may be a thermalstimulus, a radiant stimulus, a magnetic stimulus a chemical stimulus ora mechanical stimulus.

Alignment System

Build plate 80 may further comprise an alignment sensor 105. Printedobject 91 may comprise one or more alignment fiducials 102 which mayinteract with one or more alignment sensors 105 to precisely alignprinted object 91 with build plate 80 or with the top of a stack ofpreviously transferred printed objects. Alignment sensor 105 mayinteract with alignment fiducial 102 in the UV spectrum, or in thevisual spectrum or in the IR spectrum or magnetically, or mechanically.In conjunction with computer system 10, alignment sensors 105 may detectthe position of alignment fiducials 102 to within .01 mm of actualposition and cause build plate 80 to be positioned within 0.01 mm of apredetermined position relative to alignment fiducials 102.

Assembly Apparatus Positioner

Assembly apparatus C may comprise an X-Y positioner device 230 and abuild station 110. Build station 110 may comprise a Z positioner deviceand build plate 80. Build station 110 may interact with build plate 80and X-Y positioner device 230 to cause build plate 80, at the command ofcomputer system 10, to be positioned to within 0.01 mm of apredetermined position relative to transfer area 240 of any one of theplurality of transfer modules comprising a multi-material multi-moduleprinter system.

X-Y positioner device 230 can comprise a computer-controlled X-Ymovement system. The movement system may be but is not limited to anorthogonally connected pair of linear actuators or a planar linearmotor. Build station 110 may be in communication with the X-Y movementsystem such that build station 110 may be moved to any point within thelimits of the X-Y positioner device 230 as illustrated in FIG. 11 andFIG. 12. The X-Y movement system may be scaled such that build station110 may be moved to, and accurately positioned to accept a printed layertransferred from transfer area 240 of any of the plurality device oftransfer modules B associated with the printer. The X-Y positionerdevice 230 may further be scaled to allow build station 110 to move toan unload position, clear of all printer modules A, and transfer modulesB associated with the printer. The clearance from modules A and B may beprovided in the X-Y plane or by separation orthogonal to the X-Y plane.Build station 110 can further be provided with a rotational movementsystem to provide rotational alignment of build plate 80 with transferarea 240.

Hexapod

In another embodiment of the invention, precise location of build plate80 may be provided by a hexapod that can provide movement along the X, Yand Z axis as well as rotation about at least one axis.

Assembly apparatus C may be the integrating component of themulti-material, multi-method 3D printer. Assembly apparatus C may beprovided with a plurality of receiving devices which may accommodate themounting of printer modules A and associated transfer modules B.Receiving devices of assembly apparatus C may comprise mechanicalattachment devices to physically associate printer modules and transfermodules with an assembly apparatus C in a predetermined fashion.Receiving devices of assembly apparatus C may also be provided withlogical attachment devices to integrate the printer module processingunits with a central processing unit of FIG. 2 and FIG. 3.

FIG. 11 illustrates one embodiment of a multi-method 3D printer of theinvention. FIG. 11 shows four printer modules A and four transfermodules B associated with assembly apparatus C. The four printer modulesmay all implement different patterning and deposition techniques. Asshown in FIG. 11, a binder jetting module 1 is used for one of the fourprinter modules. Type two printer module 2, type three printer module 3,and type four printer module 4 may employ deposition and patterningtechniques other than jetted binder. Printer modules 2, 3 and 4 may bechosen from printer modules employing deposition and patterningtechniques such as, but not limited to electrophotography, off-setprinting, jetted material printing and selective laser melting.

In FIG. 11, the four printer modules/transfer modules are aligned in tworows with their proximal ends toward the center of the X-Y positionerdevice 230. A build station printed part removal area clear of theprinter modules in the horizontal plane is also illustrated.

It will be appreciated that the configuration shown in FIG. 11 is notlimited to four printer modules A and could comprise as few as twoprinter modules, or three printer modules, or more than four printermodules. It is further understood that a printed part removal area maybe provided by horizontal separation at any open space on X-Y positionerdevice 230 or may be provided by vertical separation of build station110 from printer modules A and transfer modules B.

FIG. 12 represents an alternate configuration of a multi-method 3Dprinter in which the four printer modules align at 90 degrees to theirclosest neighbors, leaving a possible unload station in the spacebetween printer modules or in a corner of X-Y positioner device 230.Other configurations will be obvious to those skilled in the art.

Plurality of Printer Modules

The multi-material multi-method 3D printer of the present invention isbased on a plurality of printer modules A with associated transfermodules B, all integrated by an assembly apparatus C. Each printermodule A may be capable of adjustment of operating parameters such asprint thickness, binder concentration, binder type, and material type.While adjustment of operating parameters may significantly affectproperties of the final printed object, each printer module createsprinted objects based on one specific method. A non-exhaustive list ofexamples of potential methods includes jetted binder printing,electrophotographic printing, off-set printing, and jetted materialprinting. The preferred method to create a given printed object may bechosen based on the capabilities of the separate methods such aspractical thickness range, minimum feature size, precision, and printrate. While most printing methods may be compatible with one or morematerial, the basic materials may require specific preparation for usewith specific methods.

In practice, a multi-material multi-method 3D printer of the inventionmay be configured with one printer module A for each combination ofprinter method and materials required in the final manufactured parts.In a preferred embodiment of the present invention, at least one of theplurality of printer modules making up a multi-method 3D printer systemmay be quickly and easily replaced with another module, as required fora specific final part.

In one embodiment, at least one of the printer modules may be based onjetted binder technology for multi-material 3D printer applications.

As an example, consider a printer system that includes a first printermodule and a second printer module. The first material (deposited by thefirst printer module) and the second material (deposited by the secondprinter module) need not be different. (1) Consider a case where jettedbinder printer is used in the first printer module and an electrographicprinter is used in the second printer module. A jetted binder printercan typically deposit material under deposition conditions including adeposition layer thickness in a range of 25 μm to 2,000 μm and anelectrographic printer can typically deposit material under depositionconditions including a deposition layer thickness in a range of 3 μm to75 μm. The deposition layer thicknesses associated with jetted binderprinters and electrographic printers are different. Therefore, theprinter system would be capable of assembling multiple single-layerobjects having different thicknesses into a single three-dimensionalobject (printed part).

(2) A jetted binder printer can typically deposit material underdeposition conditions including a voxel resolution in a range of 25 μmto 4,000 μm and an electrographic printer can typically deposit materialunder deposition conditions including a voxel resolution in a range of 3μm to 150 μm. The voxel resolutions associated with jetted binderprinters and electrographic printers are different. Therefore, theprinter system would be capable of assembling multiple single-layerobjects having different voxel resolutions into a singlethree-dimensional object (printed part).

As another example, consider a printer system that includes a firstprinter module and a second printer module. The first and second printermodules need not be different (both could be jetted binder printers).The printer modules are configured to deposit different materials. Thefirst printer module forms first patterned single-layer objectscharacterized by a first material characteristic and the second printermodule forms second patterned single-layer objects characterized by asecond material characteristic. Consider a case where the first materialis a ceramic precursor with negligible concentration of pore-formingagents, the concentration configured to create a ceramic with a porosityin a range of 0% to 10%, and second material is a ceramic precursor witha higher concentration of pore-forming agents, the concentrationconfigured to create a ceramic with a porosity in a range of 25% to 75%.Accordingly, the printer system would be capable of assembling multiplesingle-layer objects having different porosities into a singlethree-dimensional object (printed part).

In one embodiment, the printer comprises a plurality of printer modulesA that may each be associated with one of a plurality of transfermodules B, all of which may be coordinated with an assembly apparatus C.The plurality of printer modules may comprise printer modules employingat least two different deposition and patterning techniques and each oneof the plurality of printer modules A may be configured to createprinted objects of one material. Each printer module A may createprinted objects with a different material, or some printer modules A mayuse the same material, or all of the printer modules of a 3Dmulti-method printer system may use the same material. Printer modulesA, with associated transfer modules B, may be configured to be easilyjoined with or removed from assembly apparatus C, allowing for easycustom configuration of the printer to match the build requirements. Acentral computer system 10 (controller) may coordinate the operation ofall the components of the printer.

Pattern Generation

The 3D printing system described above is used to create structures oftwo or more materials in complex three-dimensional patterns wherein thestructure is built up in layers, each layer comprised of one or morematerials. The pattern of each material in each layer may be generatedin a manner similar to pattern generation for each layer of aconventional 3D printer. Specifically, the patterns for each layer maybe derived from a slice of the whole structure through the use of CAD(computer aided design) software, such as, for example, SolidWorks.Unlike conventional 3D printers, in embodiments of the invention, thecomputer system 10 may separate the pattern of each layer into more thanone material and into voxels that require different properties even asthe material is the same as in other voxels. For instance, voxelsrequiring finer resolution and thus smaller voxel size may be sent toprinter modules employing high resolution deposition and patterningtechnology even though the material is fundamentally the same.

Material Types

Material types may be chosen from at least two basic categories: robustmaterials and fugitive materials.

Robust materials are those that survive a post printing processing stepto become the non-compressible voxels of the final printed part. Therobust materials may survive a post processing step identical incomposition and structure to the material as it was when printed. Arobust material may also start as precursors of the final material. Apost process may cause the precursors of a robust material to react tocreate a new chemical compound or to change phase or to change crystaltypes.

A fugitive material is one that can occupy voxels within a printed partthat are designed to be occupied by a gas or a vacuum immediately aftera post processing step. A fugitive material may be comprised of a solidor semi-solid material during the printing process, and during theprocess of assembling printed objects into a printed part. During a postprocessing step, a fugitive material is converted into a format that caneasily escape from a printed part such as a gas or a liquid. The resultof including a contiguous mass of voxels of fugitive material within avolume of robust material is a cavity of a predetermined configuration,after a post processing step. The cavity may be in communication withthe outside of the printed part via a predesigned passage or may becompletely sealed. A sealed cavity may be occupied by a predeterminedgas or a vacuum.

Process

The basic process for manufacturing a 3D printed part is illustrated inFIG. 13. As shown in FIG. 13, the process starts with a Design file 310fully defining the structure, materials and specifications of thedesired part. The design file may be sliced 510 into layers, thethickness of each layer determined by specifications for each positionwithin the printed part, such as final thickness and pattern tolerance.Each layer may then be separated into regions that require differentmaterial and/or a different printing technique 520. Printer controlinstructions for each of the regions of different material/techniquerequirement may then be transferred to appropriate printer modules A ofthe printer system.

A central processing unit, such as the central processing unit shown inFIG. 2, has the capability to generate printer control files and forwardthem to appropriate printer control units for each printer module A.Central processing unit may also directly control an assembly apparatusC, including causing the positioning of build plate 80 of FIG. 5 suchthat printed objects 91 may be transferred from carrier substrate 200 ina predetermined sequence.

A build sequence starts by providing materials appropriate for each ofthe print modules A of the plurality of print modules A. Each differentpatterning and deposition technique may require material in differentformats with respect, for example, to particle size, particlemorphology, binder content and carrier vehicle. For printer modulesbased on powder bed and jetted binder technology, the feed stockmaterial may be a fluidized material with particle sizes ranging between0.0001 mm and 0.25 mm and exhibiting superior flow and self-packingproperties.

With continued reference to FIG. 13, after the part to be printed issliced into layers 510, the first 2D layer may be selected 515 and thelayers separated into objects 520 print instruction may be sent to ajetted binder printer module loaded with the correct fluidized material525 for the desired printed object, and the printed object created 530in the transfer module. The printed object may then be aligned 540 withBuild station 110. Printed object 91 may than be transferred 550 tobuild station 110. After each printed object on each printed layer 580is aligned and transferred to build station 110, the build station maybe moved to receive a printed object from another print station 1 of themulti-material multi-method printer system. When the last printed objectof a printed layer is positioned on build station 110, build plate 80 ofprint station 110 may be incremented down 590 the thickness of the nextlayer, and the build instructions for the next printed layer selectedand separated into different materials within the printed layer 520. Theprocess may continue from step 520 through step 560 until the lastprinted object of the printed part 90 has been assembled on buildstation 110. When the last printed object 91 has been added to theprinted part 90, build station 110 may be moved 565 to a part removalarea, and released from build station 110.

FIG. 14 illustrates a detailed process for the jetted binder printermodule. After the part to be printed is sliced into layers 610 and thelayers separated into objects 620 and queued to the proper printstation, print instructions may be sent to a jetted binder printermodule loaded with the correct fluidized material for the desiredprinted object. The creation of printed objects on each of the printstations A required to complete the selected printed layer with thedeposition of fluidized material 640 from each involved print station onrespective carrier device 200. Carrier devices 200 may then be indexed650 to move the deposited fluidized materials to respective compactionsdevices 30. The fluidized materials may then be compacted 660 to apredetermined level by compaction devices 30.

Carrier device 200 may then be indexed 670 to printer device 40, and apredetermined pattern printed 680 thereon by printing device 40. Thepatterned fluidized materials may then be indexed 690 on carrier device200 to material fixing device 50 and fixed 700 to make the printedpattern robust. The patterned and fixed flowable powder may than beindexed 710 on carrier device 200 to fluidized powder removal device 60,where fluidized powder which is not patterned and fixed may be removed720 from carrier device 200, leaving only the predetermined printedobjects. Carrier devices 200 are further indexed 730 on carrier device200 to transfer station 240 to align the printed objects with buildstation 110.

The printed object may than be transferred 740 to build plate 80 or thetops of previously printed objects of printed part 90. If the printedobject is not the last of the printed objects required for the printedpart 760, the next printed layer is selected and print instructions sent770 to the print stations required to complete the selected layer.Printing the remainder of the printed part continues through the loopfrom step770 through step 760 until the last printed object istransferred to build station 110, where build station 110 is removed 780to a part removal area.

Fluidized material appropriate for the target printed object may bedispersed on carrier substrate 200 by dispensing device 20. Dispensingdevice 20 may be located at a distal end of printer module A. Dispensingdevice 20 may comprise a material conditioning unit 24 which maycondition a fluidized material in order to dispense a uniform layer offluidized material in a precisely controlled layer of predeterminedthickness.

Following a deposition of fluidized material, carrier substrate 200 maymove the deposited fluidized material toward a proximal end of printmodule A to compaction device 30. Compaction device 30 may be activatedto apply a stimulus to a layer of fluidized material to increase thepacking density within a layer of fluidized material to at least 40% ofthe theoretical density of the material.

Following the compaction of a fluidized material, carrier substrate 200may move toward a proximal end of printer module A, thus transporting acompacted fluidized layer into proximity of printer device 40. Printerdevice 40 may deposit a precisely measured volume of a binder materialto every voxel of fluidized material that comprises the printed objectundergoing creation. A binder material dispensed by printer device 40may be chosen to securely bind particles of a fluidized material into arobust mass. Printer device 40 may be capable of depositing bindermaterial of a predetermined volume to every voxel in a printed object.Voxel size in a jetted binder printed object may be as small as 0.010mm.

Following deposition of binder material into the fluidized material of aprinted object, carrier substrate 200 may be caused to move toward aproximal end of printer module A to a fixing device 50. Fixing device 50may comprise a source of emissions capable of causing a binder materialto bind together particles of fluidized material and fix them into arobust mass of a predetermined pattern and thickness. Emissions fromfixing device 50 may be, but are not limited to thermal radiation, UVradiation, visible radiation, IR radiation, magnetic waves or particlebeams.

With a printed object fixed together as a robust mass and affixed tocarrier substrate 200, carrier substrate 200 may be caused to move tofluidized material removal device 60 of FIG. 6. Fluidized materialremoval device 60 may be provided with a disruptive device 61, an airknife device 62 and a vacuum port 64. Disruptive device 61 maymechanically disrupt fluidized material in the vicinity of a printedobject which has not been fixed in place with binder material fromfixing device 50. To further disrupted partially unfixed fluidizedmaterial 86, an air knife device may blow partially unfixed fluidizedmaterial away from fixed fluidized material 88 and carrier 200. Airknife device 61 may also aerosolize all unfixed fluidized material whichmay then be removed from enclosure through vacuum port 64 under theinfluence of an external vacuum source.

Movement of carrier substrate 200 from a distal end of printer module Amay be controlled by coordinated action of proximal buffer device 212and printing drive motor 250 of FIG. 5. Additional buffer devices may beprovided between dispensing device 20 and proximal buffer device 212 tomore conveniently coordinate a movement of a printed object betweencomponents of printer module A.

A printed object 91 free of unfixed fluidized material and partiallydisrupted fluidized material may be transported by carrier substrate 200to transfer device 76. With computer system 10 coordinating actions ofassembly apparatus C and transfer device 200, a printed object 91 may betransferred, with guidance of alignment sensor 105, to build plate 80,or the top of a stack of previously transferred printed objects 90. Thealignment sensor aligns the fiducial marker to the build plate (assemblyplate).

Transfer

Each of the plurality of printer modules A can create a printed object91 as shown in FIGS. 7, 8, 9 and 10. A printed object may comprise allor a portion of a printed layer, and each printed object may becomprised of a single material and may have been created by a singlepatterning and deposition technology. After a printed object 91 iscomplete on carrier substrate 200 of a transfer module B, it may bemoved to a transfer area 240, as shown for example in FIG. 5. Buildstation 110 may be caused to move by X-Y positioner device 230, underdirection from computer system 10, to a predetermined location. Buildplate 80 may be caused to move by Z positioner device 100 to apredetermined vertical location relative to carrier substrate 200. Finalprecise alignment of build plate 80 with printed object 91 affixed tocarrier substrate 200 may be accomplished by coordination amongalignment sensor 105 with reference to alignment fiducial 102, computersystem 10, X-Y positioner device 230, and Z positioner device 100. Thecarrier substrate comprises a fiducial marker 102 for each of thepatterned single-layer objects on the carrier substrate.

With precise alignment established between printed object 91 and buildplate 80, transfer of a printed object may be accomplished as transferdevice 76 causes printed object 91 to be moved into contact with buildplate 80 or the top of a stack of previously transferred printedobjects. To complete a transfer, transfer device 76 may apply apredetermined pressure to carrier substrate 200, and adhesion modifierdevice 74 can be activated by application of an appropriate stimulus. Ina case where a printed layer is comprised of a plurality of printedobjects 91, each one of the plurality or printed object 91 may becomplementary to the other ones of the plurality of printed objects 91such that all the voxels comprising a printed layer may be occupied witha voxel of a printed object 91.

As each printed object is transferred to previously transferred printedobjects, activation of adhesion modifier device 74 can cause theadhesion between printed object 91 and carrier 200 to be reduced.Surfaces of the contacting printed object 91 and previously transferredprinted objects 90 may be prepared to adhere to each other more stronglythan printed object 91 adheres to carrier substrate 200. Preparation ofthe surfaces of printed object 91 and previously transferred printedobjects may be accomplished by, but not limited to an engineeredproperty of the surfaces of the materials comprising a printed objectand a previously transferred printed object, or by an in situ surfacetreatment by a radiant source, or by an in situ treatment by a chemicalsource, or by an in situ treatment by a mechanical source, or by an insitu treatment by a magnetic source.

Printed Layer Creation

The first layer of a printed part may be transferred as one or moreprinted objects 91 on an adhesion reducing device 68 which can beassociated with a top surface of build plate 80. All subsequent layersmay be transferred onto previously transferred printed objects 90 as oneor more printed objects. FIG. 15 represents the possible steps ofcreation of a printed layer 92 by the sequential transfer of, for thisexample, five printed objects. The sequence progresses from top tobottom. During creation step 85, a printed object 93 may be transferredto a stack of previously transferred printed layers. Creation step 86may be the transfer of printed object 94, comprised of a differentmaterial and/or created by a different technology form printed object93, into an open area of creation step 85. Creation step 87 may continueas with creation step 86 by transferring printed object 95 into an openarea of creation step 86. Creation step 88 may add printed object 96.Creation step 89 may complete printed layer 92 by transferring printedobject 97. As each material in each layer is printed, it is stacked onpreviously printed objects in sequence to generate the desired structurein three dimensions and in two or more materials. While the exampleillustrates 5 different printed objects comprising the printed layer, itwill be understood that a printed layer could comprise as few a oneprinted object or any number required to satisfy the designrequirements.

Although a variety of examples and other information was used to explainaspects within the scope of the appended claims, no limitation of theclaims should be implied based on particular features or arrangements insuch examples, as one of ordinary skill would be able to use theseexamples to derive a wide variety of implementations. Further andalthough some subject matter may have been described in languagespecific to examples of structural features and/or method steps, it isto be understood that the subject matter defined in the appended claimsis not necessarily limited to these described features or acts. Forexample, such functionality can be distributed differently or performedin components other than those identified herein. Rather, the describedfeatures and steps are disclosed as examples of components of systemsand methods within the scope of the appended claims. Claim languagereciting “at least one of” a set indicates that one member of the set ormultiple members of the set satisfy the claim.

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only, and not limitation. Numerous changes to the disclosedembodiments can be made in accordance with the disclosure herein withoutdeparting from the spirit or scope of the invention. Thus, the breadthand scope of the present invention should not be limited by any of theabove described embodiments. Rather, the scope of the invention shouldbe defined in accordance with the following claims and theirequivalents.

Although the invention has been illustrated and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others skilled in the art upon the reading andunderstanding of this specification and the annexed drawings. Inaddition, while a particular feature of the invention may have beendisclosed with respect to only one of several implementations, suchfeature may be combined with one or more other features of the otherimplementations as may be desired and advantageous for any given orparticular application.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. Furthermore, to the extent that the terms “including”,“includes”, “having”, “has”, “with”, or variants thereof are used ineither the detailed description and/or the claims, such terms areintended to be inclusive in a manner similar to the term “comprising.”

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

1.-23. (canceled)
 24. A method of manufacturing a three-dimensionalobject comprising: repeatedly forming patterned single-layer objectsaccording to a predetermined sequence and predetermined patterns; andassembling the sequence of the patterned single-layer objects into thethree-dimensional object on an assembly plate; wherein forming each ofthe patterned single-layer objects comprises: dispensing fluidizedparticles onto a carrier substrate to form a material layer; compactingthe material layer to a predetermined compaction range; printing abinder material on the material layer according to a predeterminedpattern; selectively fusing the material layer according to thepredetermined pattern; removing non-fused portions of the material layerto form one of the patterned single-layer objects; and transferring theone of the patterned single-layer objects from the carrier substrate tothe assembly plate.
 25. A three-dimensional, additive manufacturingsystem comprising: a printer module to form a sequence of patternedsingle-layer objects on a carrier substrate, the printer modulecomprising a plurality of material storage devices and a plurality ofdispensing devices corresponding to one of the plurality of materialstorage devices.
 26. The system of claim 25, wherein the first printermodule comprises a jetted binder printer.
 27. The system of claim 25,wherein the materials in the plurality of material storage devices aredifferent than one another.
 28. The system of claim 25, wherein theplurality of dispensing devices each comprise a dispensing controller.29. The system of claim 25, wherein the dispensing controller isconfigured to meter an amount of fluidized particles dispensed onto thecarrier substrate.
 30. The system of claim 25, wherein the dispensingcontroller is configured to control the uniformity of material in theplurality of material storage devices.
 31. The system of claim 25,wherein the plurality of dispensing devices each comprise a roller tospread fluidized particles on the carrier substrate.
 32. The system ofclaim 25, wherein the plurality of material storage devices eachcomprise a fluidized powder.